JPH0322914Y2 - - Google Patents

Info

Publication number
JPH0322914Y2
JPH0322914Y2 JP1985155606U JP15560685U JPH0322914Y2 JP H0322914 Y2 JPH0322914 Y2 JP H0322914Y2 JP 1985155606 U JP1985155606 U JP 1985155606U JP 15560685 U JP15560685 U JP 15560685U JP H0322914 Y2 JPH0322914 Y2 JP H0322914Y2
Authority
JP
Japan
Prior art keywords
gas
bonding
group
window
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985155606U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6263933U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985155606U priority Critical patent/JPH0322914Y2/ja
Publication of JPS6263933U publication Critical patent/JPS6263933U/ja
Application granted granted Critical
Publication of JPH0322914Y2 publication Critical patent/JPH0322914Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1985155606U 1985-10-09 1985-10-09 Expired JPH0322914Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985155606U JPH0322914Y2 (en]) 1985-10-09 1985-10-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985155606U JPH0322914Y2 (en]) 1985-10-09 1985-10-09

Publications (2)

Publication Number Publication Date
JPS6263933U JPS6263933U (en]) 1987-04-21
JPH0322914Y2 true JPH0322914Y2 (en]) 1991-05-20

Family

ID=31076456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985155606U Expired JPH0322914Y2 (en]) 1985-10-09 1985-10-09

Country Status (1)

Country Link
JP (1) JPH0322914Y2 (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133262Y2 (en]) * 1980-08-14 1986-09-29

Also Published As

Publication number Publication date
JPS6263933U (en]) 1987-04-21

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